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Structural Analysis Product List and Ranking from 35 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 03, 2025～Dec 30, 2025
This ranking is based on the number of page views on our site.

Structural Analysis Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 03, 2025～Dec 30, 2025
This ranking is based on the number of page views on our site.

  1. アイテス Shiga//Electronic Components and Semiconductors
  2. 一般財団法人材料科学技術振興財団　MST Tokyo//Testing, Analysis and Measurement
  3. null/null
  4. 4 テラバイト Tokyo//software
  5. 4 センチュリテクノ Tokyo//software
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Structural Analysis Product ranking

Last Updated： Aggregation Period:Dec 03, 2025～Dec 30, 2025
This ranking is based on the number of page views on our site.

  1. Failure analysis of an orange LED damaged by electrostatic discharge. アイテス
  2. Defective analysis of liquid crystal panels アイテス
  3. [Analysis Case] Extraction, Chemical Decomposition, and Structural Analysis of Lignin 一般財団法人材料科学技術振興財団　MST
  4. 4 Structural analysis of Nylon 6.10 アイテス
  5. 5 ANSYS Japan Co., Ltd. Structural Analysis Products Comprehensive Catalog

Structural Analysis Product List

1～15 item / All 85 items

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Defective analysis service

Defective analysis service

Introducing services that help improve product quality through various analytical methods and appropriate responses.

Our company provides detailed failure analysis services for various defects, including product samples from other companies. We conduct thorough investigations into the causes of defects using a wide range of analytical methods. By utilizing specialized material analysis techniques such as FTIR (Fourier Transform Infrared Spectroscopy), we can identify issues and defects related to the materials themselves. Additionally, we can utilize external facilities such as industrial testing laboratories as needed, allowing us to perform specialized analyses that cannot be handled by our in-house equipment. After discussing the details of your request and the condition of the product, we will focus our analysis on the areas where defects are most likely to occur. 【Service Examples】 ■ LED Product Analysis ■ Wire Bond Joint Analysis *For more details, please refer to the PDF document or feel free to contact us.

  • Analysis Services
  • Contract Analysis
  • Other analyses

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Structural Analysis Service

Structural Analysis Service

We will support your business promotion with analytical technology.

Our company has been a member of the UBE Group and Osaka Gas Group for approximately 40 years since its establishment, providing support for the design and troubleshooting of various equipment such as chemical plants and industrial machinery through our analytical technology. We will support your design operations with our proven structural analysis technology. For example... - Stress evaluation of newly designed equipment - Prompt investigation of the causes of equipment failure and verification of countermeasure effectiveness - Standard evaluations to obtain approvals from public institutions and customers - Consideration of business partners to address the shortage of CAE personnel Please feel free to consult with us.

  • Contract Analysis

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Structural analysis of nanomaterials

Structural analysis of nanomaterials

We offer contract services for structural analysis and morphological observation at the nanoscale.

We offer contract services for structural analysis and morphological observation of nanomaterials such as nanotubes using TEM, SEM, and EDS in the nanoscale region.

  • Contract measurement

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[Structural Analysis Example] Impact Analysis of a Rigid Sphere on a Protective Net

[Structural Analysis Example] Impact Analysis of a Rigid Sphere on a Protective Net

Modeling the net and support pillars to simulate the impact of a rigid sphere of falling rocks!

We will introduce a case study on the analysis of the strength and behavior of a protective net when it is impacted by falling rocks. It is possible to confirm not only the deformation of the net and the generated stress due to the impact of a rigid sphere but also the stress and deformation of the support posts caused by the net pulling on them. This analysis allows for the verification of the load-bearing capacity and failure behavior of the protective net, which can contribute to more optimal protective designs. [Analysis Results] - Confirmation of the deformation of the net and generated stress due to the impact of a rigid sphere, as well as the stress and deformation of the support posts caused by the net pulling on them. - Ability to verify the load-bearing capacity and failure behavior of the protective net. - Possible contribution to more optimal protective designs. *For more details, please refer to the related links or feel free to contact us.

  • Structural Analysis

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[Structural Analysis Example] Coupled Problem 1 Using Particle Method (SPH)

[Structural Analysis Example] Coupled Problem 1 Using Particle Method (SPH)

Modeled by the particle method (SPH)! The SPH water and Lagrange rotor blades apply contact conditions.

We will introduce a case study regarding "Bird Strike on Turbine Rotors." The properties of the bird are modeled as water using the Smoothed Particle Hydrodynamics (SPH) method. Contact conditions were applied between the SPH water and the Lagrangian rotor blades. In the related links below, we present the analysis results in images, so please take a look. 【Case Overview】 ■ SPH (Smoothed Particle Hydrodynamics) is suitable for analyzing fluid dispersion and large deformations. ■ The bird is modeled using the particle method (SPH). ■ The properties of the bird are modeled as water. ■ Contact conditions were applied between the SPH water and the Lagrangian rotor blades. *For more details, please refer to the related links or feel free to contact us.

  • Structural Analysis

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[Structural Analysis Example] Plastic Poisson's Ratio Curve Using Bézier Curves

[Structural Analysis Example] Plastic Poisson's Ratio Curve Using Bézier Curves

Reproduce the exam results! Conduct optimization calculations using the coordinates of control points as design variables.

The plastic Poisson's ratio - equivalent plastic strain relationship is represented by two Bézier curves. Optimization calculations were conducted using the coordinates of the control points as design variables. We are attempting to reproduce the test results. In the related links below, we introduce graphs before and after the optimization calculations, so please take a look. *For more details, please refer to the related links or feel free to contact us.*

  • Structural Analysis

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IC failure analysis

IC failure analysis

By combining various methods suitable for failure modes, we can consistently address everything from the identification of defective nodes to physical analysis.

We would like to introduce Aites Inc.'s "Defect Analysis of ICs." Our company provides a comprehensive approach to ICs by combining methods suitable for various defect modes, from identifying defective nodes to physical analysis. We offer various analysis techniques, including "Light Emission Analysis/OBIRCH Analysis," which allows layout verification using a Layout Viewer, as well as "Layer Delamination/Sample Processing," "PVC Analysis," "Diffusion Layer Etching," and "sMIM Analysis." 【Methods】 ■ Light Emission Analysis/OBIRCH Analysis ■ Layer Delamination/Sample Processing ■ Microprobe ■ PVC Analysis ■ EBAC Analysis ■ Physical Analysis (FIB-SEM, TEM) *For more details, please refer to the PDF document or feel free to contact us.

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  • Other analyses
  • Contract Analysis
  • Analysis Services

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Failure analysis of an orange LED damaged by electrostatic discharge.

Failure analysis of an orange LED damaged by electrostatic discharge.

We will introduce a comparison of brightness and characteristics between good products and ESD-damaged products, along with examples of luminescence analysis using EMS microscopy!

We conduct failure analysis of orange LEDs that have been damaged by electrostatic discharge (ESD). LEDs that have been destroyed in ESD testing and show a decrease in luminous intensity can be analyzed using emission luminescence and the IR-OBIRCH method, allowing us to clarify the failure phenomena. We have examples such as "Comparison of brightness and characteristics between good products and ESD-damaged products" and "Luminescence analysis using emission microscopy." [Analysis Examples] ■ Comparison of brightness and characteristics between good products and ESD-damaged products - By polishing the lens part of a bullet-type LED to flatten it, dark areas were observed during brightness comparison. ■ Luminescence analysis using emission microscopy - In ESD-damaged products, dark areas were observed under forward bias, while only the damaged areas emitted light under reverse bias. ■ IR-OBIRCH and SEI analysis - Detailed damage locations were identified through IR-OBIRCH analysis of ESD-damaged products. *For more details, please refer to the PDF document or feel free to contact us.

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  • Analysis Services
  • Contract Analysis

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Defective analysis of liquid crystal panels

Defective analysis of liquid crystal panels

We will narrow down the defective areas through lighting confirmation, panel disassembly, and optical microscope observation!

We provide a defect diagnosis menu for LCD panels, from confirming defects to identifying causes and conducting detailed failure analysis. In the initial analysis, we perform a status check (lighting test), panel disassembly, and optical microscope observation, tailored to the defect symptoms. In the detailed analysis, based on the diagnostic results from the initial analysis, we propose suitable methods such as surface analysis, cross-sectional analysis, and component analysis. It is also possible to speculate on the mechanisms of defect occurrence, including narrowing down the production processes that caused the defects. 【Analysis Content】 ■ Initial Analysis - Status check (lighting test), panel disassembly, optical microscope observation, conducted according to defect symptoms - Narrowing down from general areas such as cell panels and peripheral circuits to finer details ■ Detailed Analysis (additional analysis fees apply) - Based on the diagnostic results from the initial analysis, we propose suitable methods such as surface analysis, cross-sectional analysis, and component analysis - It is also possible to speculate on the mechanisms of defect occurrence, including narrowing down the production processes that caused the defects *For more details, please refer to the PDF document or feel free to contact us.

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  • Analysis Services
  • Contract Analysis

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Analysis of crystal grains below 30nm using the EBSD method.

Analysis of crystal grains below 30nm using the EBSD method.

EBSD: Electron Backscatter Diffraction

By conducting EBSD analysis on thinned samples, higher spatial resolution can be achieved compared to conventional bulk samples.

  • Contract Analysis

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[Analysis Case] Structural Analysis of Epoxy Resin

[Analysis Case] Structural Analysis of Epoxy Resin

Structural analysis of LED encapsulants using thermal decomposition GC/MS method.

Epoxy resin is excellent in heat resistance, chemical resistance, and insulation properties, and also has high mechanical strength, making it suitable for various applications such as insulation materials for electronic devices, adhesives, paints, and construction materials. However, due to the lack of solvent solubility, the analytical methods for structural determination are limited. This case presents an example of thermal decomposition GC/MS measurement of epoxy resin used as a sealing material for LEDs. The thermal decomposition products reflecting the structures of the main agent and curing agent were obtained, and this resin was estimated to be a bisphenol A/anhydride type epoxy resin.

  • Contract Analysis

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[Analysis Case] Structural Analysis of Amorphous SiNx Films Using Molecular Dynamics Calculations

[Analysis Case] Structural Analysis of Amorphous SiNx Films Using Molecular Dynamics Calculations

Microscopic structural analysis of amorphous films is possible through simulation.

Amorphous SiNx (a-SiNx) films exhibit significant changes in physical properties from semiconductors to insulators due to compositional variations such as the N/Si ratio, making them suitable for a wide range of applications, including gate insulating films for transistors. On the other hand, experimental methods capable of atomic-level microscopic structural analysis for materials with non-crystalline amorphous structures are limited. Therefore, creating and analyzing amorphous structures with various compositions and densities through simulation becomes an effective tool. This document presents examples of structural analysis of a-SiNx films using molecular dynamics calculations.

  • Contract Analysis
  • Memory

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